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Action PC(冷却ファン) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Action PC Product List

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Free fluid simulation software [OpenFOAM]

Free fluid simulation software [OpenFOAM]

We provide support from hardware to software implementation!

OpenFOAM is a fluid simulation software that allows for numerical fluid analysis free of charge. Software for such fluid analysis includes ANSYS's FLUENT and CFX, as well as CD-adapco's STAR-CD and STAR-CCM+. However, depending on the module configuration, some of these software packages can have high annual usage fees. That is why Applied is currently supporting the transition to OpenFOAM, which can be used for free. This time, we will also introduce suitable hardware for using OpenFOAM. ■ Various parts can be customized according to your needs! ■ Recommended models based on application and software usage are also available! ■ On-site hardware maintenance can be added! *For a fee

  • server
  • EAI/ETL/WEB application server
  • Action PC

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Applied Moldex3D Recommended PC

Applied Moldex3D Recommended PC

Moldex3D is software with an intuitive interface that can be mastered by both experts in analysis and beginners, offering high reproducibility.

Moldex3D is a three-dimensional resin flow analysis software that boasts a world-class market share. It analyzes the entire mold, including parts, runners, and cooling channels, in three dimensions and reproduces it with high accuracy. In addition to solvers specifically designed for resin flow analysis, such as flow, cooling, and deformation, it offers robust computational features for fiber orientation, stress, and viscoelasticity. It also supports various special molding techniques, enabling efficient solutions for molding defects and optimization of molding conditions. The developer, CoreTech System Co., Ltd., was founded in Taiwan in 1995. Since then, it has led the plastic injection molding industry and continues to provide excellent CAE solutions. Moldex3D is equipped with a variety of optional features in addition to basic analysis functions such as flow, packing pressure, cooling, and deformation (warpage) to meet all the resin flow analysis needs required in design settings. Notably, it features advanced 3D mesh technology-based analysis solvers for fiber orientation and viscoelasticity, an interface with FEA (Finite Element Analysis), analysis tools for molding processes such as hot runners, and modules that support special molding techniques like compression molding and FIM (Fine Bubble Resin Injection Molding).

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  • Structural Analysis
  • Thermo-fluid analysis
  • Mechanism Analysis
  • Action PC

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